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The effect of thermal conductivity of RIM moulds in kinetics cure

Mateus, A., Bartolo, P. J., Mitchell, G., Silva, M., Pouzada, A. S. and Pontes, A. J. (2007) The effect of thermal conductivity of RIM moulds in kinetics cure. In: Paulo, J. d. and Jorge, M.A. (eds.) Virtual and Rapid Manufacturing. Taylor and Francis, pp. 389-394. ISBN 9780415416023

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Abstract/Summary

Reaction Injection Moulding (RIM) is a moulding technology used for the production of large size and complex plastic parts. The RIM process is characterized essentially by the injection of a highly reactive chemical system (usually polyurethane) and fast cure, in a mould properly closed and thermally controlled. Several studies show that rapid manufacturing moulds obtained in epoxy resins for Thermoplastic Injection Moulding (TIM) affect the moulding process and the final properties of parts. The cycle time and mechanical properties of final parts are reduced, due to a low thermal conductivity of epoxy materials. In contrast, the low conductivity of materials usually applied for the rapid manufacturing of RIM moulds, increase the mechanical properties of final injected parts and reduce the cycle time. This study shows the effect of the rapid manufacturing moulds material during the RIM process. Several materials have been tested for rapid manufacturing of RIM moulds and the analysis of both, temperature profile of moulded parts during injection and the cure data experimentally obtained in a mixing and reaction cell, allow to determine and model the real effect of the mould material on the RIM process.

Item Type:Book or Report Section
Refereed:Yes
Divisions:Faculty of Science > School of Mathematical and Physical Sciences
Interdisciplinary centres and themes > Chemical Analysis Facility (CAF) > Electron Microscopy Laboratory (CAF)
ID Code:919
Additional Information:Collection of 120 peer-reviewed papers that were presented at the 3rd International Conference on Advanced Research in Virtual and Rapid Prototyping, held in Leiria, Portugal in September 2007.
Publisher:Taylor and Francis

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