A supramolecular polymer based on tweezer-type pi-pi stacking interactions: molecular design for healability and enhanced toughnessBurattini, S., Greenland, B. W., Hayes, W. ORCID: https://orcid.org/0000-0003-0047-2991, Mackay, M. E.,, Rowan, S. J. and Colquhoun, H. M. (2011) A supramolecular polymer based on tweezer-type pi-pi stacking interactions: molecular design for healability and enhanced toughness. Chemistry of Materials, 23 (1). pp. 6-8. ISSN 1520-5002 Full text not archived in this repository. It is advisable to refer to the publisher's version if you intend to cite from this work. See Guidance on citing. To link to this item DOI: 10.1021/cm102963k Abstract/SummaryAn elastomeric, healable, supramolecular polymer blend comprising a chain-folding polyimide and a telechelic polyurethane with pyrenyl end groups is compatibilized by aromatic pi-pi stacking between the pi-electron-deficient diimide groups and the pi-electron-rich pyrenyl units. This interpolymer interaction is the key to forming a tough, healable, elastomeric material. Variable-temperature FTIR analysis of the bulk material also conclusively demonstrates the presence of hydrogen bonding, which complements the pi-pi stacking interactions. Variable-temperature SAXS analysis shows that the healable polymeric blend has a nanophase-separated morphology and that the X-ray contrast between the two types of domain increases with increasing temperature, a feature that is repeatable over several heating and cooling cycles. A fractured sample of this material reproducibly regains more than 95% of the tensile modulus, 91% of the elongation to break, and 77% of the modulus of toughness of the pristine material.
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